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Founded
Website
http://www.rntfoil.com

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Patents
KANDO id: 389905

Corporate information

Official name
Reactive NanoTechnologies Incorporated
Registration country
United States

Company type

Developer of a patented reactive foil that can melt solder or braze without using a standard furnace or torch.

Funding rounds

N/A


Profile Country
SAS Investors
United States

N/A


Profile Country
Eastward Capital Partners LLC
United States

N/A


Profile Country
Maryland Technology Development Corp (TEDCO)
United States
Sevin Rosen Funds Texas-based venture capital firm credited with pioneering the personal computing revolution in the 1980s and also venture investing in Dallas.
United States

N/A


Profile Country
Siemens Venture Capital GmbH The corporate venture organisation for Siemens AG
Germany

N/A


Profile Country
Silicon Alley Seed Investors

N/A


Profile Country
Toucan Capital Corp LLC
United States


Investment activity status
Active investor

Current team

Past employees

Selected Products / Customers

Financials